We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead
Tecnimont, MAIRE’s flagship company for Integrated E&C solutions with a presence in multiple countries, is an established powerhouse in the realm of innovative engineering and construction services, crafting the infrastructure for tomorrows world. Tecnimont is seeking