We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross‑functional
For engineering services in the Manufacturing area. WHAT MAKES YOU A FIT: The Technical Part: Bachelor’s Degree in Engineering and three (3) years of exposure within the Medical Devices Industry. Bilingual: Spanish and English Soft Skills:
FITS, LLC in Villalba, Italy, is looking for a qualified engineer to design manufacturing processes and ensure efficient production layouts for assemblies. The ideal candidate has a Bachelor’s Degree in Engineering and at least three years of experience