OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms
Responsibilities Working closely with CTO office Lead technology liaison activities with leading global research institutes and universities across European countries. Identify emerging semiconductor technologies and research trends with a mid‑ to long‑term perspective Initiate, structure, and support
Hitachi Automotive Systems Americas, Inc. is seeking an experienced R&D Senior Engineer to spearhead the development and integration of advanced packaging solutions in Genoa, Liguria. This role requires a Masters or Ph.D. and at least 7 years
Global Technology Liaison – Semiconductor R&D and Academic Collaboration Full-time Employment Type: Regular (PERM) Remote Work Available: No Key Responsibilities Working closely with the CTO office Lead technology liaison activities with leading global research institutes and universities
Experteer Italy is looking for a professional to design and develop power module packaging solutions. This role requires at least 3 years of experience in power semiconductor packaging and a degree in Mechanical Engineering.You will work closely with suppliers
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold
Experteer OverviewIn this role you will drive global technology liaison efforts with leading research institutes to identify mid‑to long-term semiconductor opportunities aligned with Renesas’ strategy. You will build trust‑based partnerships across Europe and with internal teams to
Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense 3 days ago Be among the first 25 applicants Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense Direct
About the CompanyFlexLink, headquartered in Gothenburg, Sweden, is an industry leader in automated production and material flow solutions, providing customers with state-of-the-art solutions that deliver production efficiency and enable sustainable manufacturing.FlexLink serves a broad customer base
About Us Axelera AI is not your regular deep-tech startup. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us. In just four years,
About the CompanyA group of innovation-based industrial and packaging solutions companies operating globally, headquartered in Bologna, Italy.Coesia’s companies are leaders in automation solutions for multiple industries, ranging from automated processing and packaging machinery, testing and vision systems, to
At Tetra Pak we commit to making food safe and available, everywhere; and we protect whats good – protecting food, protecting people, and protecting the planet. By doing so we touch millions of peoples lives every
A group of innovation-based industrial and packaging solutions companies operating globally, headquartered in Bologna, Italy. Coesia’s companies are leaders in automation solutions for multiple industries, ranging from automated processing and packaging machinery, testing and vision systems, to digital
About the CompanyA group of innovation-based industrial and packaging solutions companies operating globally, headquartered in Bologna, Italy. Coesia’s companies are leaders in automation solutions for multiple industries, ranging from automated processing and packaging machinery, testing and vision systems,
A group of innovation-based industrial and packaging solutions companies operating globally, headquartered in Bologna, Italy. Coesia’s companies are leaders in automation solutions for multiple industries, ranging from automated processing and packaging machinery, testing and vision systems, to digital
Experteer OverviewIn this role you will help design and develop power module packaging solutions within Vishay’s R&D organization. You will bridge design and manufacturing to create robust, manufacturable, and cost‑efficient packaging, collaborating with R&D, suppliers, and production teams.
What You’ll DoLead optical device and assembly process qualification for Cisco’s optical transport and optical transceiver products.Responsibilities include:Technical assessment of optical suppliers including next‑generation technologies, material systems, packaging solutions and quality/reliability.Conduct design and process reviews and audits
About FBK FBK is a research institution devoted to excellence in research across numerous disciplines and designated to keep the Autonomous Province of Trento in the mainstream of European and international research. Each research area is
A group of innovation-based industrial and packaging solutions companies operating globally, headquartered in Bologna, Italy.Coesia’s companies are leaders in automation solutions for multiple industries, ranging from automated processing and packaging machinery, testing and vision systems, to digital printing
About the Company: FlexLink is a leading organization headquartered in Göteborg, Sweden and has operating units in 26 countries and is represented in more than 60. We are a leading provider of high-end solutions to manufacturing