We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead
Ref: KM47430 A semiconductor equipment manufacturing company is currently recruiting a Field Service Engineer to support the installation, commissioning, training, and after-sales service at their customer site in Italy. The ideal candidate will have mechanical engineering and service
Tecnimont, MAIRE’s flagship company for Integrated E&C solutions with a presence in multiple countries, is an established powerhouse in the realm of innovative engineering and construction services, crafting the infrastructure for tomorrows world. Tecnimont is seeking Process