We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross‑functional execution from
Nexperia is seeking a Principal Engineer for GaN Package Development in Catania, Italy. This role focuses on developing and industrializing advanced packaging technologies for GaN power devices. The ideal candidate will lead package architecture, ensuring performance, reliability, and cost
# Engineer Research & Development SimulationApplylocations: Torino, ITtime type: Full timeposted on: Posted Todayjob requisition id: JR-14460 We are seeking great talent to help us build The DNA of tech. Vishay manufactures one of the worlds largest portfolios
Job Responsibilities Architect, model, and define sub‑system specifications for advanced power management solutions, including DC‑DC converters (inductive and capacitive), LDOs, shunt regulators, and multi‑rail PMIC architectures. Translate system‑level specifications into elegant, robust, and cost‑effective silicon solutions;