THE INTERNSHIP We are looking for an Intern to join our Automation team, which manages Siemens PCS7 DCS systems based on a virtualized infrastructure supporting production plants. During the internship, you will work alongside senior technicians and
SiC Process Engineering - Wafer Laser Splitting & Grinding M/F In this role you will contribute to the SiC technology ramp-up at ST in a new mass-production fab in Catania, driving efficient finishing processes for SiC substrates. You